>Date: Mon, 05 Jul 1999 18:04:22 -0400
>To: Michael Fenner <[log in to unmask]>
>From: joyce <[log in to unmask]>
>Subject: Re: [TN] adhesive to solder mask adherence issue
>
>check your pick and place machine, see if any machine oil leak on the
header... (check the machine repair maintainance record)... just a
thought...It happened before...jk
>At 09:57 PM 7/4/99 +0100, you wrote:
>>Go with the probabilities: the most likely thing to have changed is in
>>processing rather than materials. Without wishing to teach you how to suck
>>eggs I think it would be helpful to go back to basics and ensure what you
>>are actually
>>doing is what you think you are doing / what you have told your
>>operatives to do. In my experience most problems with adhesives
>>which used to work and now don't can be tracked down to finger trouble;
>>usually storage and handling procedures suffer from a standard which slips
>>in small unnoticed increments and eventually tips you over into trouble. The
>>"We aren't doing anything different" thing  may not actually be true if you
>>look back far enough...
>>Whether this is the case for you or not you still have to establish that you
>>are following basic ground rules before you can move on to investigate more
>>esoteric causes, and certainly if you are going to go back to outside
>>vendors you need the certainty of knowing that your process is not at
>>fault.
>>
>>Mike Fenner
>>BSP, OX15 4JQ, England
>>T:+44 1295 722 992
>>F: +44 1295 720 937
>>-----Original Message-----
>>From: Cory and Lise Steeby <[log in to unmask]>
>>To: [log in to unmask] <[log in to unmask]>
>>Date: 02 July 1999 18:35
>>Subject: [TN] adhesive to solder mask adherence issue
>>
>>
>>>We are using adhesive to place SMD components and are seeing the something
>>>fail in the adhesive system.  Parts are falling off the board prior to  the
>>>wave soldering process and the cured adhesive does not pass the "snap"
>>test.
>>>
>>>When parts are snapped off the board the glue remains on the part and the
>>>PCB is clean.  The problem did not show up in earlier runs of identical
>>>product.  We have investigated the PCB fabricators process, the adhesive
>>>curing process and the adhesive.  Does anyone have any advice?
>>>
>>>The adhesive is Loctite 3614
>>>The mask is Hysol SR1010G
>>>
>>>
>>>Thanks in advance,
>>>
>>>Cory Steeby
>>>EBW Electronics, Inc
>>>701 Commerce CT
>>>Holland, MI 49424
>>>[log in to unmask]
>>>
>>
>