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July 1999

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Subject:
From:
Bob Vanech <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 1 Jul 1999 14:12:03 +0000
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  Hi all..
       Have a question relating to cooling a HOT 225-ball
  BGA. I tried to look in the archieves, but my search
  technique must be lacking or I am using the wrong
  "words". Can I use an "underfill" to help cool a hot
  BGA or is that the wrong term? I am considering using
  a thermally conductive, electrically insulating
  material under the part (3parts/assy), but have no
  hands-on experience with "what material, how do I apply
  it and what are the related war stories". Any help out
  there in TechNet land???? Thanks in advance, have a
  great day and a super/safe 4th holiday!!!!!!!!!

                          Regards,
  Bob Vanech                      Bob
  Mango Computers
  Norwalk, Ct.
  (203) 857-4008 x 108

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