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July 1999

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Subject:
Anybody here doing the Test S?
From:
"Tumibay, Aleli" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 3 Jul 1999 20:09:16 -0400
Content-Type:
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text/plain (11 lines) 
Hello Technetters:
  I would like to have a rough picture of the industry's current practice re
solderability testing.
  Anybody here who has adopted the Simulated Board Mounting Reflow
Solderability Testing (described in IPC's "Test S" of J-STD-002 and  procedure
"3" of EIA/JESD22-B102) as an alternative to the Dip&Look and  Wetting Balance
test for SMDs? Any concerns?
  Would appreciate your response.
  Regards,
  Lei Tumibay

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