Hi Ryan! Here are a couple of references which will prove useful:

  Akinade,K. et all, "Lead Free Solder Pastes Evaluation at Motorola
  Transmission Products Division", Soldering and Surface Mount Technology,
  No20, May 1995, pages 50-54.

 Glazer, J. , et all, "Thermal Reliability of 58Bi-42Sn Solder Joints",
Design & Reliability of Solders and Solder Interconnections, edited by
Frear, Winterbottom, Sastry, Murty, Liaw, Mahidhara, 1997, pages 229-245.

Klein Wassink's book also has some good information. The basic issue with
the Sn/Pb/Bi element combination is that a solder alloy can be formed that
has a melting point of 98C which makes solder joint thermal cycle life
pretty "exciting". Many uses of the 43/43/14 solder alloy are in
environments which do not go above the 98C limit. Good Luck.

Dave Hillman
Rockwell Collins
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Ryan Jennens <[log in to unmask]> on 07/02/99 10:32:34 AM

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Subject:  [TN] Bi Alloy




Almost to the weekend!

    Can anybody point me to some research, or experimental findings, etc.,
of the formation of the very low melting point alloys which form from the
43Sn43Pb14Bi alloy after it is reflowed?  Previous inquiries about this
alloy left me with replies that stated after reflow, some different alloys
are formed which have a liquidus ~98C.  Are there published details?
Online
publications would be much appreciated, but books can be researched if
necessary.

-Ryan Jennens
TelGen Corporation