Cory,

We have experienced a similar problem in the past. Two things we
found/checked for/changed and the problems went away. I don't know if this
will be the same for you.

We were using pin transfer technology then. The operators were loading a
"pot" with epoxy and then using it past its "open pot" life. A second thing
found in our investigation was that the date codes on the packages had
expired. We found the shelf life of the unopened containers was important
as well as the open pot time.

We now stencil on epoxy when we use it and we watch the date codes very
carefully. No more problems.

Good luck.

Charlie Barker
Sr. Manufacturing Engineer
Input/Output, Inc.
Stafford, Texas
281-552-3328





Cory and Lise Steeby <[log in to unmask]> on 07/02/99 12:22:27 PM

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 Subject: [TN] adhesive to solder mask adherence issue









We are using adhesive to place SMD components and are seeing the something
fail in the adhesive system.  Parts are falling off the board prior to  the
wave soldering process and the cured adhesive does not pass the "snap"
test.

When parts are snapped off the board the glue remains on the part and the
PCB is clean.  The problem did not show up in earlier runs of identical
product.  We have investigated the PCB fabricators process, the adhesive
curing process and the adhesive.  Does anyone have any advice?

The adhesive is Loctite 3614
The mask is Hysol SR1010G


Thanks in advance,

Cory Steeby
EBW Electronics, Inc
701 Commerce CT
Holland, MI 49424
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