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July 1999

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Date:
Fri, 30 Jul 1999 13:30:44 -0400
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Ioan,
to the best of my knowledge, the packaging field will be picking up, but not
necessary SMT.  Currently, the on chip delay is less due to the shrinkage of
chip size and device feature.  However, with fast speed it comes with more
problems in packaging: heat (due to high density chip, just take a look of
recent post on the TechNet about the thermal pad issue) and off chip delay
become more of the issue.  Low voltage chip, associated with smaller
features and high density, will cause problem on many areas, such as leakage
current, interconnect methods (high speed required consideration such as
skin effect, residue capacitance etc.)...Getting into the packaging field
would be a good bet, but may not be SMT...Multi-chip-Module and other form
of packaging is getting more popular these days...Knowledge base job in the
packaging field would have a good future..(I hope...however, see some of my
Sr. colleagues got laid off recently, I do have some doubt...At least no
body pays me high $$ yet..;-)...
my 2 cents...just for your reference...
good luck...
                                  jk
At 12:12 PM 7/30/99 -0400, you wrote:
>Technos,
>
>since everybody is happy and has time to check spelling, I'm going to ask
>your oppinion on something totally non-technical.
>
>Many of you have more years in this industry than my age, so you saw it
>grow. How do you see the future of SMT? Will it continue to be a booming
>business, or, five years from now the assemblies will be one ASIC placed on
>a 1"x1" board and that's it, no more discrete components, no more wave
>soldering, no rework, etc.
>
>Shall I return to good old lathes and milling machines, or I'll be able to
>feed my children out of electronic manufacturing, many years from now?
>
>Actually my company is in shut down for two weeks and that's why I waste my
>time with stupid questions (sorry, but any oppinion is welcomed).
>
>Thanks,  Ioan
>
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