We are using adhesive to place SMD components and are seeing the something
fail in the adhesive system.  Parts are falling off the board prior to  the
wave soldering process and the cured adhesive does not pass the "snap" test.

When parts are snapped off the board the glue remains on the part and the
PCB is clean.  The problem did not show up in earlier runs of identical
product.  We have investigated the PCB fabricators process, the adhesive
curing process and the adhesive.  Does anyone have any advice?

The adhesive is Loctite 3614
The mask is Hysol SR1010G


Thanks in advance,

Cory Steeby
EBW Electronics, Inc
701 Commerce CT
Holland, MI 49424
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