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July 1999

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Subject:
From:
Nick Nicolaides <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 29 Jul 1999 08:18:51 -0400
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We have a very serious dewetting problem with at least one supplier. We have
seen as much as 80% with the HASL down to 10 microinches. The area of
dewetting can not be reflowed, we have tried. problem is from copper/tin
intermettalics, poor cleaning after applying solder mask, contamination,
etc. get a good FA lab like NEXTEK and have them run on a X-Ray floroscope.

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