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July 1999

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 28 Jul 1999 23:39:14 EDT
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Hi Kathy,
You have my sympathies; when people in the same company work at
cross-purposes you can expect nothing but trouble.
I certainly have no idea what 'evidence' your Purchasing people will consider
being adequate, given the evidence you already have. However, perhaps you
need failed solder joints to convince them. Just cross-sectioning your SJs
with inadequate wetting will not convince them (given your statements), but
if you take some of the assemblies made (under protest as you state) and
T-shock them 25C<->110C, your product excursions, for about 30 cycles (they
are likely to fail much earlier), you would get some beautiful (?) fractured
solder joints showing failure at the interface in the absence of a
metalurgical bond (intermetalic compounds).
If that does not convince them, nothing will.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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