Hi Poh,

 Yes there is a standard for solder balls
 None
You can see this in IPC-A-610B 4.1
Defect for Class 1,2,3
and as a Nonconforming Process Indicator Class 1.2.3.

Please also note the section in IPC-A-610B Foreword page vi 
pertaining to Magnification Aids and Lighting.  This might help you
to determine if you really have a problem . You did not state size.

Also please note Board Orientation on the same page as above

I hope this helps But you really need to evaluate why you have solder balls after your solder wave process.

There are many reasons for solder balls and many corrective 
action that can be taken if all the information is given.

Maybe we  ( IPC Neters ) / IPC can help remove the solder balls if you would please   reissue your question as to what the problem is 
  along with your process profile for solder wave & Items using
I for one can say the IPC Group is great and If they can't help they
can tell you who can.
 
If you need more on 610 lets us  (Technets )  know.
Nancy



>>> Poh Kong Hui <[log in to unmask]> 06/24/99 04:08AM >>>
Hi Technetters,

I have a curious question to ask. Is there any specification state the
amount of solder balls allowed on the bottom side or the side that
undergo wave-soldering process.

It is rather common to see solder balls formed in-between the leads
of the connectors, or in-between the leads. However, is there any
spec. to define the amount of balls allowable on the board.

There are people used to remove the solder balls by brushing away -
how about the spec ???

Poh

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