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July 1999

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Subject:
Texas Instruments 6701 BGA Package
From:
Rick Thompson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 28 Jul 1999 11:06:25 -0700
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Hi,

We've recently started receiving Texas Instruments C6701 DSP chips in a 352
pin BGA package with a large metal heat slug on the top.  It appears the
weight of the slug causes the balls to over collapse during reflow,
increasing the amount of shorts we experience.  Does anyone have any
experience placing and reflowing this package?  Any suggestions as to reflow
profiles or other stuff I should look at would be appreciated.

Thanks.

Rick Thompson
Ventura Electronics Assembly
2665A Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858 voice
+1 (805) 584-1529 fax
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