TECHNET Archives

July 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Poh Kong Hui <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 24 Jun 1999 16:08:29 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines)
Hi Technetters,

I have a curious question to ask. Is there any specification state the
amount of solder balls allowed on the bottom side or the side that
undergo wave-soldering process.

It is rather common to see solder balls formed in-between the leads
of the connectors, or in-between the leads. However, is there any
spec. to define the amount of balls allowable on the board.

There are people used to remove the solder balls by brushing away -
how about the spec ???

Poh

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2