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July 1999

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 26 Jul 1999 19:38:42 -0400
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Ivan, Hans,
        I would not consider using bed-of-nails testers for circuit packs as
a special case.  Our company and many, many others have been using no-clean
fluxes for almost a decade now.  The use of proper pin heads, a good PM
cleaning/replacement regime for the pins, proper spring tension and the use
of a good quality no-clean flux, along with the other things that Jon and
Kenneth mentioned, should make the problem of pin testability good away.
For some no-cleans the use of nitrogen will help, as some of them have a
tendency to go "crusty" in air.  I do not believe you should have to "change
the way you test and/or solder $$$)".

regards,
Bev Christian
Nortel Networks

> -----Original Message-----
> From: Hinners Hans CIV WRALC/LYPME [SMTP:[log in to unmask]]
> Sent: Monday, July 26, 1999 4:32 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] No clean flux residue
>
> Hi Ivan and All,
>
> As you have discovered there really isn't a 'no clean' flux (at least with
> 'special' cases, yours - Probe; mine - Conformal Coating).  Somebody
> correct
> me if I'm wrong but you have a couple of choices - clean the probes, clean
> the boards, or change the equipment/process (i.e.. change the way you test
> and/or solder $$$).
>
> The question I have for the group: Would soldering in an inert environment
> remove the need for flux all together?  I would swear I have seen that
> mentioned somewhere recently (where o where? - was it PC FAB or maybe
> Precision Cleaning).
>
> Hans
>
> Air Force Material Command - We keep them flying!
> ~~~~~~~~
> Hans M. Hinners                                 WR-ALC/LYPME Bldg. 640
> Materials Engineer                                      380 Second Street,
> Suite 104
> Manufacturing Eng. Sec.                         Robins AFB GA 31098-1638
> 912-926-1970 (Voice) 468 - 1970 (DSN)   912-926-7974 (Fax)
> [log in to unmask]
>
>
> > Hello Technetters:
> > Being new to the list, I do not know if this issue has been discussed in
> > the
> > past, so here goes. What can be done to minimize/eliminate the residue
> > left by
> > the no clean fluxes on the PCB's? We currently have a big issue with
> > residue not
> > allowing our test pin probes to make contact. We have implemented
> cleaning
> > the
> > probes on a regular basis, but I want to eliminate the issue altogether.
> > If this
> > has been discussed, please point me in the right direction (archived
> > responses).
> > If not, I would really appreciate your help.
> > Ivan Barrios
> > Process Engineer
> > Conexant Systems
> > El Paso, TX,
> >
>
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