looks like some one is trying to cover up a mistake  the gold and copper
will beacon one. but if this was for a ni peeler ???????
> -----Original Message-----
> From: Ed Cosper [SMTP:[log in to unmask]]
> Sent: Monday, July 26, 1999 12:09 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] NI/AU UNDER BETWEEN COPPER
>
> hmmmm.... good question.  and I have no clue as to reliability. I wonder
> why
> someone would do that in the first place unless it was reworking a
> mistake.
> This is a new one on me.
>
> Ed Cosper
>
>
> -----Original Message-----
> From: [log in to unmask] <[log in to unmask]>
> To: [log in to unmask] <[log in to unmask]>
> Date: Monday, July 26, 1999 1:12 PM
> Subject: [TN] NI/AU UNDER BETWEEN COPPER
>
>
> >I just looked at a product where the manufacturer has managed to
> >overplate nickel/gold with copper.  This occurs on the surface conductors
> >and also in holes.
> >
> >I have looked in the design and board documents, but cannot find anything
> >that addresses the reliability of such a condition.  I know putting a
> >"meltable"
> >material between layers of copper can wreak havoc, but what about
> >ni/au?
> >
> >Susan Mansilla
> >Robisan Lab
> >
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