Hi Ivan and All,

As you have discovered there really isn't a 'no clean' flux (at least with
'special' cases, yours - Probe; mine - Conformal Coating).  Somebody correct
me if I'm wrong but you have a couple of choices - clean the probes, clean
the boards, or change the equipment/process (i.e.. change the way you test
and/or solder $$$).

The question I have for the group: Would soldering in an inert environment
remove the need for flux all together?  I would swear I have seen that
mentioned somewhere recently (where o where? - was it PC FAB or maybe
Precision Cleaning).

Hans

Air Force Material Command - We keep them flying!
~~~~~~~~
Hans M. Hinners                                 WR-ALC/LYPME Bldg. 640
Materials Engineer                                      380 Second Street,
Suite 104
Manufacturing Eng. Sec.                         Robins AFB GA 31098-1638
912-926-1970 (Voice) 468 - 1970 (DSN)   912-926-7974 (Fax)
[log in to unmask]


> Hello Technetters:
> Being new to the list, I do not know if this issue has been discussed in
> the
> past, so here goes. What can be done to minimize/eliminate the residue
> left by
> the no clean fluxes on the PCB's? We currently have a big issue with
> residue not
> allowing our test pin probes to make contact. We have implemented cleaning
> the
> probes on a regular basis, but I want to eliminate the issue altogether.
> If this
> has been discussed, please point me in the right direction (archived
> responses).
> If not, I would really appreciate your help.
> Ivan Barrios
> Process Engineer
> Conexant Systems
> El Paso, TX,
>

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