I just looked at a product where the manufacturer has managed to
overplate nickel/gold with copper.  This occurs on the surface conductors
and also in holes.

I have looked in the design and board documents, but cannot find anything
that addresses the reliability of such a condition.  I know putting a
"meltable"
material between layers of copper can wreak havoc, but what about
ni/au?

Susan Mansilla
Robisan Lab

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