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Date: | Sat, 24 Jul 1999 08:08:02 -0400 |
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Sulfuric is preferred over Hydrochloric for oxide removal because HCl
tends to increase in etch activity as the dissolved copper concentration
goes up with use. 10% H2SO4 will be a much more stable and reliable
process for oxide removal. Save the nitric for things like stripping
copper off your plating racks.
Andy Magee
Flex Guru - Consulting
[log in to unmask]
(937) 435-3629
ps. Initially copper foil is provided from the supplier with a zinc
chromate passivation coating to prevent oxidation. Since this angstroms
thick, relatively brittle, layer may not be uniformly intact it should
be removed with a process that will not attack the copper before
microetching. 10% H2SO4 is clearly the preferred choice over HCl, but
there are also a number of proprietary acid/surfactant mixtures that are
widely used for this.
LeRoy wrote,
Subject: Re: Copper oxide removal
Date: Fri, 23 Jul 1999 15:56:52 -0400
From: LeRoy Forney <[log in to unmask]>
My understanding of the usual oxide removal procedure is a 3-minute soak
with 5%HCl. The goal is a very mild
etch, and I've heard that nitric acid will cause pitting instead - and
this is in line with some laboratory
oxidation studies I did some time ago. Variability in solderability
data was much higher on aged coupons I had
treated with dilute HNO3 than on coupons treated with 5%HCl.
LeRoy
-----Original Message-----
From: nishath yasmeen [SMTP:[log in to unmask]]
Sent: Friday, July 23, 1999 3:34 PM
To: [log in to unmask]
Subject: [TN] Copper oxide removal
Hello everyone!
Is Nitirc acid ( dilute) a better acid than sulfuric for cleaning
the oxide on plated copper?
Any information provided will be appreciated.
Yasmeen
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