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July 1999

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Subject:
Re: Copper oxide removal
From:
LeRoy Forney <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 23 Jul 1999 15:56:52 -0400
Content-Type:
text/plain
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text/plain (44 lines) 
My understanding of the usual oxide removal procedure is a 3-minute soak with 5%HCl.  The goal is a very mild etch, and I've heard that nitric acid will cause pitting instead - and this is in line with some laboratory oxidation studies I did some time ago.  Variability in solderability data was much higher on aged coupons I had treated with dilute HNO3 than on coupons treated with 5%HCl.

LeRoy
-----Original Message-----
From:   nishath yasmeen [SMTP:[log in to unmask]]
Sent:   Friday, July 23, 1999 3:34 PM
To:     [log in to unmask]
Subject:        [TN] Copper oxide removal

Hello everyone!
    Is Nitirc acid ( dilute)  a better acid than sulfuric for cleaning
the oxide on plated copper?
    Any information provided will be appreciated.

Yasmeen

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