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July 1999

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Subject:
From:
Mike Bailey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 21 Jul 1999 07:17:20 -0700
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You aren't going to like this!  If it's Polyclad PCL-FR-370, we've had
improvement in holewall texturing using several different desmear
chemistries by utilizing a 2 hour postdrill bake @ 300 F.  SEM's do show
improved topography.  I've also heard it stated that improved texturing
doesn't necessarily equal improved holewall adhesion. The end product speaks
for itself.

-----Original Message-----
From: Tony Charais [mailto:[log in to unmask]]
Sent: Wednesday, July 21, 1999 6:09 AM
To: [log in to unmask]
Subject: [TN] Permanganate Problems


  We are seeing an occasional problem with our current permanganate process.
We have a DOE running but we are having problems developing topography in
the hole on a given product. This is a high aspect ratio multilayer board.
We are confident that the problem isn't related to fluid transfer in the
hole. This product is based on a PolyClad core. Has anyone else had problems
with PolyClad material? We are wondering if it could be something to do with
their resin. Any support from the technet would be appreciated.

Tony Charais
Manufacturing Engineer
[log in to unmask]

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