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July 1999

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 21 Jul 1999 09:56:14 +1000
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This is cute Lee , so what's your problem (apart from the obvious = scarred
all the mammals off!)?
Open's = Outer balls, inner ?

If you're crunching basics (with Heinz I presume) check Intel's 1999
databook ;
if you want to see what you do or don't ; check Ersa's BGA scope ,
reflow center support you have I hope ; decent dispenser/stencil as well
(?);
be specific please if you need a doctor ; hard to guess it :
Did you slice it ?
The opens : fractured ; planar process ; solder deficiency ; flux only/paste
? ; wetability (osp,gold) ?
AND the ever controversial post handling : ATE ; depanelisation (always
BEFORE TEST); assembly handling (pressing micros to some adjacent sockets
won't help) etc. etc.

No problems with "hard hits" ; but lets hit the guilty subject :
WHAT did you see ? Only opens off ATE ?


Paul Klasek
http://www.resmed.com

-----Original Message-----
From: Lee McCuistion [mailto:[log in to unmask]]
Sent: Monday, 19 July 1999 20:09
To: [log in to unmask]
Subject: [TN] Soldering 492 PGBA on OSP/FR4


I need some hard hitting process checks to help isolate open solder
joint problems occurring under 492 PGBA devices on our OSP surfaced
PCBs.  If you've worked through problems in this area before I'd
appreciate some of your insights.

Lee McCuistion
Manufacturing Engineer
Cubix Corporation
2800 Lockheed Way
Carson City, NV  89706
702-888-1000 x237 (voice)
702-888-1002 (fax)
[log in to unmask] (e-mail)
"Never intervene in the affairs of Dragons! ...
Cus' like you are crunchy and taste good with Ketchup"

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