Eric

Annotated reply below

>Hello.  I am trying to get our approval for wave soldering on several space
>programs which are currently hand soldered.  In doing so, I have been
>confronted with several questions.  The main areas of concern for our folks
>are:
>
>1.  Does the wave solder process induce any thermal shock to the components
>or exceed the thermal spec's of the components?
>      I realize that it will depend on the component and the wave temp, but
>does anyone know of papers, doe data, etc. that I can access and mount a
>convincing argument?
>
You just can't avoid going to component level specs, I know from experience!

>2.  Will the wave solder process warp the PC board?
>      Again, what I am looking for is hard data to marshal an argument. If
>so, how can we mitigate warpage?
>
It shouldn't on its own, you can also use custom jigs. There are a multitude
of See IPC A 610, basically 1.5% for pth and 0.75% for smt. Any bow and
twist will induce stress which many component manufacturers will say their
components can withstand but a word of caution - temporary stress (eg during
breakout) may substantially increase causing latent damage.

>3.  For those companies that use page frames, do you wave solder with or
>without a it attached?  Also, is a pre-bake recommended to remove moisture?
>If so, are there industry guidlines?
>
I assume you mean jigs/supports (my terminology), Solder with jigs attached.

It depends on how your boards are used and stored. Quick usage from
delivery/unpacking should mean you don't have to bake. As moisture is an
adsorbed matter it depends on your environment. Basically there is no
general need to bake.

>I realize that this is a huge request, but I would appreciate any pointers,
>especially where to go to find the information.
>
>
>Eric Kalgren
>BFGoodrich Aerospace
>Data Systems Division
>(505) 938-5139
>[log in to unmask]
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