TECHNET Archives

July 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Jul 1999 07:25:57 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (146 lines)
Matt,
Just two hours oven for rigid-flex with rigid polyimide before HAL,are you
sure?
Edward


> -----Original Message-----
> From: Matthew Sanders [SMTP:[log in to unmask]]
> Sent: β ιεμι 20 1999 6:26
> To:   [log in to unmask]
> Subject:      Re: [TN] Rigid-Flex Board baking
> 
> I do two hours at 125 C, and this seems to work fine (the oven is at 125
> when I put boards in). If that hasn't worked, it's usually been because of
> lack of cleanliness of the copper surface prior to coverfilm lamination,
> and
> through working with my fab shops, we've been able to improve situations
> like that.
> 
> I'm also using the LF material for the coverfilm. The base is all
> adhesiveless (and I've never been happier - yields are up dramatically
> with
> it), but we still have that acrylic for the coverfilm. Some on this list
> have said they've had luck with other types of adhesive (epoxies and the
> like), but I've never played with them.
> 
> Hey, it's my first response to a question on Technet! I've been asking for
> the past year, but I've never added anything myself.
> 
> Matt
> 
> Matthew Sanders
> PCB/Metal Procurement Engineer, Trimble Navigation Ltd.
> [log in to unmask]
> Phone: (408) 481-7817
> Fax: (408) 481-8590
> 
> 
> -----Original Message-----
> From: Steve R Mikell [mailto:[log in to unmask]]
> Sent: Monday, July 19, 1999 2:14 PM
> To: [log in to unmask]
> Subject: Re: [TN] Rigid-Flex Board baking
> 
> 
> Charles Barker asked
> 
> *********************************************************************
> Charles Barker
> 07/18/99 01:53 PM
> 
> To:   [log in to unmask]
> cc:
> 
> Subject:  Board baking
> 
> We are just getting into regular assembly of rigid-flex boards. What are
> folks doing about removing the moisture absorbed in the flex?
> 
> Is anyone using nitrogen as a drying agent?  What are sources of
> "dry-boxes" and such?
> 
> All you flex makers out there, what do you recommend?
> 
> TIA
> 
> Charlie Barker
> 
> ************************************************************************
> 
> Charlie,
> 
> Its a Monday, so give us some time to get cranked up.  First, are you
> talking
> old style or modern rigid-flex.
> If you are using the old polyimide layers with acrylic adhesive, you can't
> do
> enough good things to guarantee success.
> If, on the other hand, you are using the all polyimide construction, the
> survivability is greatly enhanced.
> 
> If your boards are pre-baked and sealed in moisture proof bags, you may be
> able to process without a prebake.  Moisture in your facility and time
> "out
> of
> bag" will determine the need and severity of your bake.  In cases like
> these,
> I always try and get any "scrappers" from the PWB fab house for
> experiments.
> 2 hours at 105 C would be a good starting point if baking proves
> necessary.
> 
> Good luck,
> 
> Steve Mikell
> Lead Ind. Eng.
> Plant 13
> SCI Systems
> 
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following
> text in
> the body:
> To subscribe:   SUBSCRIBE TECHNET <your full name>
> To unsubscribe:   SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information.
> If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
> 847-509-9700 ext.5365
> ##############################################################
> 
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in
> the body:
> To subscribe:   SUBSCRIBE TECHNET <your full name>
> To unsubscribe:   SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information.
> If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
> 847-509-9700 ext.5365
> ##############################################################

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2