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July 1999

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Subject:
Underfill on Micro BGA
From:
John Harris <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Jul 1999 11:37:47 +1000
Content-Type:
text/plain
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text/plain (23 lines) 
Micro BGA

Do Micro BGA's require underfill or encapsulation to ensure the solder
joints aren't stressed during the life of the product.

Any thoughts or recomendations would be appreciated!

Thanks

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