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July 1999

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Subject:
From:
Robert Wang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Jul 1999 08:41:19 +0800
Content-Type:
text/plain
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> ----------
> From:         Alvin Leong[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Alvin Leong
> Sent:         Monday, July 19, 1999 8:06 PM
> To:   [log in to unmask]
> Subject:      [TN] DFM Rule or Guide line
>
> Hi,
>         Anyone out there can recommend the DFM (Design for
> Manufacturability)
> guide line or rules. Presently, I'm facing a solderability defect
> (although
> it has about 0.6% and it is the higher contributor for the yield loss.)
> "Open Joint & Skewing" at one of the thin film resistor, where donot
> really
> understand any DFM violation on the design or process related or material
> related. It processed in the N2 reflow environment, is the conventional
> reflow profile suitable for this component of 90/10 compostion plating on
> terminal?
>
> Thanks in advance for any piece of word.
>
> Alvin Leong
>
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