Hi,
        Anyone out there can recommend the DFM (Design for Manufacturability)
guide line or rules. Presently, I'm facing a solderability defect (although
it has about 0.6% and it is the higher contributor for the yield loss.)
"Open Joint & Skewing" at one of the thin film resistor, where donot really
understand any DFM violation on the design or process related or material
related. It processed in the N2 reflow environment, is the conventional
reflow profile suitable for this component of 90/10 compostion plating on
terminal?

Thanks in advance for any piece of word.

Alvin Leong

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