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July 1999

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Subject:
From:
Chetan Shah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 18 Jul 1999 23:13:00 PDT
Content-Type:
text/plain
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text/plain (67 lines)
Charlie:

Typically pre-baking is done prior to assembly. The recommended temperature
is 250F for 2 hours. We also recommend running a dummy sample through the
reflow process with thermocouple to make sure that the profile is set
correctly for rigid-flex (it is a little different than typical rigid
boards). This will also flag if the boards still have moisture (sometimes it
has taken over 12 hours to completely rid the boards of moisture).

You can reach me at Flex Interconnect Technologies - 408-288-8625 if you
need further information.

Chetan


>From: Charles Barker <[log in to unmask]>
>Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
>To: [log in to unmask]
>Subject: [TN] Board baking
>Date: Sun, 18 Jul 1999 13:53:23 -0500
>
>We are just getting into regular assembly of rigid-flex boards. What are
>folks doing about removing the moisture absorbed in the flex?
>
>Is anyone using nitrogen as a drying agent?  What are sources of
>"dry-boxes" and such?
>
>All you flex makers out there, what do you recommend?
>
>TIA
>
>Charlie Barker
>
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