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July 1999

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Subject:
From:
Mordechai Holtzman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 17 Jul 1999 16:28:24 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines)
Att Yasmeen
Dear Yasmeen:
I saw your email in regard to UN uniform plating copper I did not follow from
the beginning whet is the application If you have non uniform plating one of
the way to day is to use Complex Wave Form-Pulse reverse plating it improved
the plating through and surface uniformity My expertise is the implementation
of the technique if I can give you more information do email me and I will
reapply ASAP.
Looking forward to hear from you

Moti Holtzman
ASET Inc.

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