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July 1999

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Subject:
From:
Sunil Gupta <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 17 Jul 1999 09:27:22 +0530
Content-Type:
text/plain
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text/plain (99 lines)
Since wave soldering is an established process since many years it would be
difficult to get recent papers.

1. All the components manufactured is specified for wave soldering. You can
refer to any component manufacturer's component specs. If they donot
provide wave solderable components than their components would not solder.

2. Wave soldering induces marginal warpage which is wit in IPC acceptable
limits. For very large size PCBs, special wave soldering machines are
available to prevent warpage.

3. If the PCBs are received in shrink packing there is no need to pr-bake
to eliminate moisture. We have observed that even if the PCBs are not
shrink packed, till one year there has been no need for pr-baking.


It would good to take around your descision makers to some factories with
similar products as yours to give them confidence. After all seeing is
easily belivable.

sunil Gupta

Manager - Process Engineering





Eric Kalgren <[log in to unmask]> on 16-07-99 01:41:00

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to Eric Kalgren <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Sunil Gupta/TTL)
Subject:  [TN] Wave Soldering Questions




Hello.  I am trying to get our approval for wave soldering on several space
programs which are currently hand soldered.  In doing so, I have been
confronted with several questions.  The main areas of concern for our folks
are:

1.  Does the wave solder process induce any thermal shock to the components
or exceed the thermal spec's of the components?
     I realize that it will depend on the component and the wave temp, but
does anyone know of papers, doe data, etc. that I can access and mount a
convincing argument?

2.  Will the wave solder process warp the PC board?
     Again, what I am looking for is hard data to marshal an argument. If
so, how can we mitigate warpage?

3.  For those companies that use page frames, do you wave solder with or
without a it attached?  Also, is a pre-bake recommended to remove moisture?
If so, are there industry guidlines?

I realize that this is a huge request, but I would appreciate any pointers,
especially where to go to find the information.


Eric Kalgren
BFGoodrich Aerospace
Data Systems Division
(505) 938-5139
[log in to unmask]

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