TECHNET Archives

July 1999

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Subject:
From:
Jason Smith <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 16 Jul 1999 16:20:10 -0400
Content-Type:
text/plain
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Any contract manufacturers out there in Technetland building any assemblies that
have to be flexed as a subsequent operation for final assembly?  What substrates
can be used?  Another solder material?  conductive adhesives?

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