IPC-R-700 C procedure 5.2.2 allowed use of surface jumper wire attached to
component leads to repair a missing/severed trace.

IPC-7721 does not include this procedure.  The closest in technique is
procedure number 4.2.4, however the jumper is soldered to residual circuit
traces.

I recognize the inherent problem of IPC-R-700 procedure 5.2.2, that it
interferes with component replacement.

The dilemma I face is that a board has been repaired using IPC-R-700 C
procedure 5.2.2, but the customer does not recognize IPC-R-700C.

Has IPC-R-700 C been totally discarded and replaced by IPC-7721?
Are the techniques of IPC-R-700 C still acceptable?

Thanks for your assistance.

Dennis Guy-Sell
Quality Engineer
EDO Electro-Ceramic Products
2645 South 300 West
Salt Lake City, Utah 84115
801-486-7481 ext. 219

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