Hello.  I am trying to get our approval for wave soldering on several space programs which are currently hand soldered.  In doing so, I have been confronted with several questions.  The main areas of concern for our folks are:

1.  Does the wave solder process induce any thermal shock to the components or exceed the thermal spec's of the components?
     I realize that it will depend on the component and the wave temp, but does anyone know of papers, doe data, etc. that I can access and mount a convincing argument?

2.  Will the wave solder process warp the PC board?
     Again, what I am looking for is hard data to marshal an argument. If so, how can we mitigate warpage?

3.  For those companies that use page frames, do you wave solder with or without a it attached?  Also, is a pre-bake recommended to remove moisture? If so, are there industry guidlines?

I realize that this is a huge request, but I would appreciate any pointers, especially where to go to find the information.


Eric Kalgren
BFGoodrich Aerospace
Data Systems Division
(505) 938-5139
[log in to unmask]

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