We are seeing non uniform plated copper deposits in very small areas on
silicon wafers from the acid copper plating bath.

I can understand the non uniformity across areas which are large (
inches) but these areas measure in micron range. The thickness profile
of this area looks like a staircase on the profilometer.  Is this a flow
problem? Does this depend on the current density?
What other factors do I need to consider for uniformity improvement?

Any suggestions will be greatly appreciated.
Thanks,
Yasmeen

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