Anne,
     Will there be any difference between heat cure and UV type solder
     resist?

     Thanks,
     WM Cheng
     Astec Power
     [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: Re: [TN] silkscreen and pads/holes
Author:  "TechNet E-Mail Forum." <[log in to unmask]>           Anne Ledger
<[log in to unmask]> at Internet
Date:    7/14/99 10:45 AM


Steven,

For thermal silkscreen we ask to be allowed to clip the artwork back by
.005".  (5 mils.)
Hope that helps.

Anne Ledger
EMDS, Inc.
[log in to unmask]


> -----Original Message-----
> From: Lustig, Steven K.. [SMTP:[log in to unmask]]
> Sent: Wednesday, July 14, 1999 10:42 AM
> To:   [log in to unmask]
> Subject:      [TN] silkscreen and pads/holes
>
> Could some of the board fabricators please tell me what number they
> use as
> backoff or spacing between holes/pads and silkscreen print when they
> generate the silkscreen artwork.  I understand that the goal here is
> to
> prevent ink from getting onto pads/holes and therefore effecting the
> soldering.
>
> Thanks.
>
> -Steve
>
> Steven K. Lustig
> Process Engineer
> EMS Technologies, Inc.
> Norcross, GA
> (770) 263-9200 x4714
> [log in to unmask]

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