 
| Subject: | |
| From: | |
| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 14 Jul 1999 14:04:02 -0700 |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
Improved Solderability over what?
A few notes to mention is that no single finish
appears to satisfy all surface finish needs.
"White Tin" is a flat planar finish that can provide
a serious cost decrease compared to ENIG. ENIG,
however, may survive more thermal excursions because
the nickle acts a solderable barrier between the solder (tin)
and the copper. Also count rework when you look at
considering a finish. So you may want to select one
over the other for prototype as opposed to production.
Cost.......I see "White Tin" being about 1/5th the cost
of ENIG. This brings it inline with OSP and HASL.
Contact both Dexter (FST) and Florida Cirtech (Omikron)
for literature to find out more about those finishes
("White Tin").
Good Luck.....
David Hoover
Field Application Engineer
McCurdy Circuits
http://www.mccurdy.com
-----Original Message-----
From: Joe Reichert [mailto:[log in to unmask]]
Sent: Tuesday, July 13, 1999 11:14 AM
To: [log in to unmask]
Subject: [TN] White Tin
Our PCB house requested that we specify using a
White Tin coating over copper for improved solderability.
Has anyone had any experience with this before?
Solderability, Cost, Oxidation, etc...?
Thanks in advance,
Joe
All views and opinions expressed are my own and may
not represent the views and opinions of my employer.
:::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::
Joe Reichert
mailto:[log in to unmask]
NorthStar Technologies, Inc.
A Lake Shore Company
575 McCorkle Boulevard
Westerville, Ohio 43082
Voice: 614-818-1150 Ext. 238
Fax: 614-818-1605
http://www.northstar-tec.com
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################
|
|
|
