I THINK ITS TIME TO FIND ANOTHER FAB HOUSE

"Tempea, Ioan" wrote:

> Hi,
>
> now that the problem with the blistering solder mask is fixed ( we sent the
> boards back since backing them was of no use), I have another one.
>
> Some of our assemblies have a high density of VIAs. On these products,
> pretty often we get after wave some solder bubbles over the VIAs, some of
> them exploded, like degassing. Since on some we see the same bubbling even
> on the fiducials, I wonder if the humidity is the only one to blame, I even
> wonder if there's any issue related to humidity at all.
>
> So, what could it be? Incompatibility between flux and solder sounds
> possible?
>
> I would appreciate any input,
>
> Ioan