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July 1999

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Subject:
From:
Barbara Burcham <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Jul 1999 10:08:59 -0500
Content-Type:
text/plain
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text/plain (45 lines)
What is 'Thermal Silkscreen"???

-----Original Message-----
From: Anne Ledger [mailto:[log in to unmask]]
Sent: Wednesday, July 14, 1999 9:46 AM
To: [log in to unmask]
Subject: Re: [TN] silkscreen and pads/holes


Steven,

For thermal silkscreen we ask to be allowed to clip the artwork back by
.005".  (5 mils.)
Hope that helps.

Anne Ledger
EMDS, Inc.
[log in to unmask]


> -----Original Message-----
> From: Lustig, Steven K.. [SMTP:[log in to unmask]]
> Sent: Wednesday, July 14, 1999 10:42 AM
> To:   [log in to unmask]
> Subject:      [TN] silkscreen and pads/holes
>
> Could some of the board fabricators please tell me what number they
> use as
> backoff or spacing between holes/pads and silkscreen print when they
> generate the silkscreen artwork.  I understand that the goal here is
> to
> prevent ink from getting onto pads/holes and therefore effecting the
> soldering.
>
> Thanks.
>
> -Steve
>
> Steven K. Lustig
> Process Engineer
> EMS Technologies, Inc.
> Norcross, GA
> (770) 263-9200 x4714
> [log in to unmask]

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