TECHNET Archives

July 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
BGA rework
From:
Nick D'Onofrio <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 13 Jul 1999 09:52:03 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (13 lines) 
  I'm wondering if anyone can assist us or offer any advice to deal with our
little dilemma. Reworking BGA's is fairly new process for us.
  I'm attempting to rework a 313 contact plastic BGA on a 10 layer board. I end up
having either cold solder or shorts between contacts. We are using a SNIPER
SMD-7007 rework station at 375 F degrees. We have used the same heat profile our
other ceramic BGA's without having any problems..

  Any comments would be greatly appreciated.

Regards,
Nick D'Onofrio
Quality Assurance

ATOM RSS1 RSS2