The following fabrication drawing notes have been suggested by a group of
individuals (engineer, technician and designer) for a complicated RF board
with tight tolerances (relatively speaking).  The smallest finished hole size
is .008 in. (vias, semi-blind), the smallest thru-hole via is .013.  The
board is .093 thick, 8 layers, SMT both sides.  Controlled impedance circuits
in the form of microstrip and stripline on outer layers and an inner layer
(respectively), the thinnest line width being .007 and the smallest spacing
.005.
Since you are all involved in the fabrication process in some way, your
(collective) feedback is desired......have a ball!  Please know that your
input will be appreciated.  Thanks, June in the Drafting


NOTES:  UNLESS OTHERWISE SPECIFIED
MATERIAL:
EPOXY GLASS, NEMA GRADE FR-4, (SHALL MEET UL 94V-0), Dk = 4.3 NOMINAL, COPPER
CLAD 1 OZ AND 2 OZ FINISHED COPPER AS SPECIFIED ON SHEET 2.  TOTAL THICKNESS
.088/.098.

PLATING/FINISH:
A) CIRCUITRY AND PLATED THROUGH HOLES SHALL BE ELECTROPLATED COPPER .001 TO
.002 THICK AND SHALL MEET OR EXCEED THE ACCEPTABILITY REQUIREMENTS OF
IPC-A-600, CLASS 2.

B) VIAS MAY BE PLUGGED.

C) CIRCUITRY AND PLATED THROUGH HOLES TO BE PLATED GOLD   (IMMERSION METHOD
ACCEPTABLE) .00003 TO .00005 THICK OVER NICKEL .00015 MIN THICKNESS.

IMPEDANCE:  SEE NOTES ON SHEET 2 FOR SPECIFIC CRITERIA. TDR TEST
CERTIFICATIONS OF EACH BOARD ARE REQUIRED.

SOLDER MASK, BOTH SIDES:
A) SOLDER MASK MATERIAL SHALL BE GREEN IN COLOR, GLOSS FINISH .001 MIN THICK,
TYPE A OR B PER IPC-SM-840, CLASS 3.
B) SOLDER MASK SHALL BE APPLIED OVER BARE COPPER ON BOTH SIDES OF  BOARD WITH
THE EXCEPTION OF PADS AND PLATED THROUGH HOLES (VIAS MAY BE COVERED).
C) SOLDER MASK SHALL BE IN ACCORDANCE WITH THE SOLDER MASK MASTER AND
REGISTRATION SHALL BE SUCH THAT 360 DEGREES OF ALL    TERMINAL LAND AREAS
(PADS) ARE EXPOSED (.000 TO .010 LARGER THAN PADS).
D) SOLDER MASK SHALL BE SMOOTH AND FREE OF LUMPS AND BUBBLES.  MASKED AREA
SHALL EXHIBIT STRAIGH, SHARPLY DEFINED EDGES.
E) SOLDER MASK MATERIAL SHALL NOT LIFT FROM PRINTED WIRING OR BASE LAMINATE
WHEN EXPOSED TO 500 DEGREE SOLDER FOR 30 SECONDS.

SILKSCREEN, BOTH SIDES:
A) SILKSCREEN SHALL BE IN ACCORDANCE WITH THE SILKSCREEN MASTER USING
PERMANENT SOLVENT-RESISTANT WHITE INK.
B) MINOR REMOVAL OF SILKSCREEN DATA IS PERMISSIBLE TO ELIMINATE INK FROM ON
PADS OR IN HOLES.  RELOCATION OF SILKSCREEN DATA IS NOT
PERMISSIBLE.
C) SILKSCREEN SHALL BE SHARPLY DEFINED AND FULLY LEGIBLE.

REGISTRATION, UNLESS OTHERWISE SPECIFIED:
A) PADS MUST BE ALIGNED WITHIN .003 FROM FRONT TO REAR.
B) LAYER TO LAYER REGISTRATION MUST BE WITHIN +/- .003.
C) HOLE TO PAD REGISTRATION SHALL BE .005 TRUE POSITION DIAMETER OF CENTER
INDICATED ON THE MASTER ARTWORK.

DRILLING:
A) SEE HOLE CHART ON SHEETS 3-6 FOR FINISHED HOLE SIZES AND TOLERANCES.
B) DRILLED HOLE SIZE OVER FINISHED HOLE SIZE MUST BE NO LARGER THAN .003 FOR
HOLES WITH LESS THAN .062 INDICATED FINISHED SIZE PER THE CHART.

GENERAL:
A) FABRICATION PROCESS SHALL BE UL APPROVED AND PCB SHALL BE IDENTIFIED WITH
MANUFACTURER'S APPROVED LOGO AND TYPE    DESIGNATION PER MANUFACTURER'S
SPECIFICATION.
B) WITH THE EXCEPTION OF TOOLING FILM ADJUSTMENT TO COMPENSATE FOR ETCH
FACTORS, NO CHANGES ARE ALLOWED TO ANY MASTER PATERN OR MEDIA WITHOUT  PRIOR
WRITTEN APPROVAL OF DESIGN ORIGINATOR.
C) ACCEPTABILITY OF MEASLING AND CRAZING SHALL MEET OR EXCEED REQUIREMENTS OF
IPC-A-600, CLASS 2.
D) WARP AND TWIST OF PWB SHALL NOT EXCEED .010 INCH PER LINEAR INCH.
E) FINISHED PRINTED WIRING BOARD SHALL AGREE WITH THE MASTER PATTERN SUPPLIED
WITH RESPECT TO PAD SIZE AND SHAPE, AND LINE WIDTH AND ROUTING.