Has any one knows chemistry for Al/Si wafer plating by Electroless Ni-AU?

Jonathan







*********** REPLY SEPARATOR ***********

On 07/13/1999, at 5:52 AM, Jack Crawford wrote:

>IPC PRINTED CIRCUITS EXPO 2000
>
>"Where the Boards Are"
>
>CALL FOR PAPERS
>
>Conference/Meetings: April 2 - 6, 2000
>Exhibition:  April 4 * 6, 2000
>
>San Diego Convention Center, San Diego, CA
>
>www.ipcprintedcircuitexpo.org
>
>Produced by: IPC
>Sponsored by:, Arizona Printed Circuits Association, California Circuits Association,
>Chicagoland Circuit Board Association, Michigan Printed Circuit Association, Midwest
>Circuits Association, North East Circuits Association, IPC Designers Council
>
>In Cooperation With:  Circuit World Magazine, CircuiTree Magazine, Circuits Assembly
>Magazine, European Federation of Interconnection and Packaging, European Institute of
>Printed Circuits, Future Circuits International, Japan Printed Circuit Association,
>PAC/Asia Circuit News, PCB International, Printed Circuit and Micro Circuit Journal ,
>Printed Circuit Design Magazine, Printed Circuit Europe Magazine, Printed Circuit
>Fabrication Magazine, Printed Circuit Interconnection Federation, , SMT Magazine,
>Targeting Singapore Electronics Audience, The Good PCB Guide
>
>WHERE THE BOARDS ARE
>IPC PRINTED CIRCUITS EXPO is where the boards are and where you'll find the people
>who design, build and use them. It is the largest conference and exhibition in North
>America for the printed circuit industry.  This event is an excellent opportunity for
>you to get involved by presenting a paper or writing the standards and guidelines
>that the industry uses.
>
>Participating in IPC Printed Circuits Expo is a great way for you and your company to
>gain visibility in the industry. Distribution of the conference proceedings to over
>1,500 companies and individuals will help insure that your paper is seen by key
>engineers and managers throughout the industry. When these industry leaders write new
>standards and guidelines, they will refer to your findings and research.
>
>The Technical Conference at IPC Printed Circuits Expo is a major attraction.  Over 80
>papers on topics such as board design, materials, manufacture and assembly technology
>will be presented.  A few of the technical sessions in 1999 were standing room only
>crowds! Whether you choose to present an original paper, chair a technical session or
>lead a workshop or tutorial, your contribution to IPC Printed Circuits Expo will be
>rewarding for you and valuable to the industry.
>
>HOW YOU CAN PARTICIPATE
>Chair a Technical Session
>Act as chairperson and organize a technical session of approximately four speakers
>from different companies, each presenting on various areas of a common theme.
>Presentations should be geared to an audience involved in the printed wiring board
>fabrication and non-commercial in nature.
>
>Individuals interested in chairing a Technical Session should reply by
>August 12, 1999.
>
>Lead a Workshop or Tutorial
>Educate your peers and contribute to the industry by teaching a three-hour workshop
>or seven-hour tutorial (the workshop or tutorial leader provides their own
>materials.)  An honorarium is offered for leaders.
>
>The deadline for workshop & tutorial proposals is September 2, 1999
>
>Workshop and tutorial presenters must provide all final handbook materials by
>February 21, 2000.
>
>Present a Paper
>Be a speaker at one of the technical sessions. This requires the submission of a
>single-page abstract of original and unpublished work covering case histories,
>research or discoveries.  The abstract should summarize the problem, the methods used
>and the results of the experiment(s).  Since the selection process is competitive,
>sufficient detail should be included in the abstract to allow the Technical Program
>Committee to assess the technical content of the proposed paper.
>
>Abstracts must be received by September 2, 1999.
>
>The paper should be a minimum of six pages and describe significant results from
>experiments, emphasize new techniques, discuss trends of interest and contain
>technical and/or appropriate test data.  Papers focused on a company's product,
>rather than the technology, will not be accepted.  Presentations without a paper are
>not permitted.  On site presentations are 30 minutes in length.
>
>Papers must comply with IPC publication guidelines and be submitted by
>January 14, 2000.
>
>BENEFITS OF PARTICIPATING
>Contribute to the Industry
>Are you interested in making a contribution in educating the industry?  Are you ready
>to position yourself and your company as technical experts?  Do you want the
>opportunity to research an area of interest?  Move forward in areas of new
>technology?  Here's the opportunity you have been waiting for*participate in the IPC
>Printed Circuits Expo Technical Program.
>
>Receive a $1,000 Award and Industry Recognition
>The author of the best technical paper will be awarded $1,000 and a recognition
>plaque.  Congratulations to the Best Paper Authors in 1999: James Keating; Robert
>Larmouth and Greg Bartlett of Teledyne Electronic Technologies.
>
>Special Passes and Discounts
>As a conference speaker, you will be entitled to a free, single-day conference pass
>or discounted registration fee for the conference and a copy of the proceedings.
>Complimentary admission to the exhibits and reception on the show floor is also
>included.
>
>IPC PRINTED CIRCUITS EXPO 2000 TECHNICAL PROGRAM COMMITTEE: Linda Self, Chair, Litton
>; Michael Carano, Electrochemicals, Inc.; Jack Fisher, ITRI; Bill Foran , Miller
>Freeman Inc ; Tom Gardeski, E. I. du Pont de Nemours and Co.; Cef Gonzalez, E. I. du
>Pont de Nemours and Co. ; Foster Gray, PC Interconnects; Pat Kane, Diversified
>Systems Inc.; Ed Kelley, Compositech Ltd. ; Brian Mc Dermott, MicroVia, Inc.; Ray
>Rasmussen, CircuiTree Magazine ; John Sharp, Teradyne Connection System; Doug Sober ,
>isolaUSA ; Gene Weiner, Weiner & Associates, Inc.
>
>SUGGESTED TOPICS:
>The Future of the Printed Circuit Board
>--Component Free PCBs (Buried Resistors/ Buried Capacitors/ Buried ICs?
>--Which HDI Processes Will Rule?
>--OEM Roadmaps for HDI PWBs
>--Fine Line Requirements
>--The Changing Face of PCB Acceptability
>--Flip Chip, CSP, and BGA as PB Drivers
>--Manufacturing Infrastructure Changes
>
>High Density Interconnect Technology Solutions
>--Tomorrow's Microvias
>--Reliability/Failure Analysis Techniques
>--Infrastructure Development
>--Case Studies
>--HDI & Microvia Production
>--Plating of Microvias
>--Laser Direct Imaging
>--Material & Processing Requirements for HDI
>--Drilling vs. Ablation/Plasma Etching
>--Sequential Build-Up
>--Plugged, Filled and/or Tented Vias
>
>PC Board Fabrication
>--Fine Line Imaging/Controlling Conductor Widths
>--Horizontal Plating of Thin Cores
>--Periodic Pulse Reverse Plating
>--Direct Metallization
>--Reducing Hole Size
>--Plating Rack Construction Effects on Current Distribution
>--High Aspect Ratio Plating
>--Bond Enhancement
>--Process Improvements and Process Control
>--Impedance Modeling
>
>Flex Circuits Processing
>--Flex Opportunities in Chip Scale and Advanced Packaging
>--New Applications & Processing Implications
>--Fine-line Flex
>--Roll to Roll Processing
>--Laser Processing Technologies
>
>Flex Circuits Materials/Reliability
>--Adhesiveless vs. Adhesive Based Laminates
>--New Material Options for Flexible Circuitry
>--Copper for High Endurance Flex
>--Covercoats
>--Flexural Fatigue Testing
>
>Designing for Leading Edge Manufacturing
>--Designing for Lower Cost
>--High Speed and Impedance Control
>--Design for Manufacture
>--Design of Microvias/HDIS
>--New Design Tools for PWBs
>--EMI/RFI, Noise Related Issues
>--CAD Design of HDI & SMT
>
>Environmental Concerns
>--Environmental Cost Accounting Tools
>--ISO 14001/Environmental Management Systems (EMS)
>--Environmentally-Friendly Manufacturing Materials/Methods
>--Taking the Lead Out of HASL
>--Cost Effective Compliance with OSHA and EPA
>--Recycling
>
>Dielectric Materials (HDI Alternatives to FR4)
>--Reinforced Materials
>--Non-reinforced Materials
>--New/Alternative Resins
>--Thermal Reliability
>--New High Tg Epoxy Systems
>--Measuring Dielectric Constant
>--Conductive Materials
>--Exceeding Current Limitations of Today's Materials
>
>Materials Used In-Process
>--Electroplating/Electroless Plating
>--Imaging
>--Soldermask
>--Oxide Alternatives
>--Inks, Pastes & Thick Films
>
>Surface Finishes for High Tech Boards (Final Finishes)
>--Alternatives to HASL
>--Organic Solderability Preservatives
>--Reliability Data
>--Component Lead Compatibility
>--Deposition Processes
>
>Electrical Testing * HDIs Final Challenge
>--Boundary Scan
>--AOI
>--Testing Blind & Buried Vias
>--High Volume Testing for HDI
>--Non Contact Tests
>
>Solderability Testing
>--Wetting Balance
>--SERA
>--Alternative Finishes
>--Analytical Control of Plating Solutions
>
>Quality and Reliability - How Do You Know?
>--Ionic Contamination
>--Plated Through-Hole Reliability
>--Design of Experiments
>--Reliability Comparisons Between Today's Board and Yesterdays
>--Continuous Process Improvement
>--Reliability testing & methods for PTH's & Microvias
>--Reliability for High Aspect Ratio Vias
>--Aging and Long Term Reliability
>--Failure Analysis
>--Reliability Modeling
>--Implementing Standards
>--Simulation of Fatigue
>
>(Please note that these are suggestions.  If you have a paper outside of these
>topics, we greatly encourage that you submit your abstract.)
>
>Free Forums
>--Technology Roadmaps
>--Market Trends & Segmentations
>--Supply Chain Management
>
>______________________
>
>Call for Papers Submission Form:
>
>I am interested in:
>  ? Chairing a Technical Session
>? Presenting a Paper
>? Leading a Workshop or Tutorial
>? Attending IPC Printed Circuits Expo 2000. Please send me more information when
>available.
>
>  ? IPC Member
>? Nonmember
>? I would like to receive event information by e-mail.
>
>-----------------------------------------
>Name:  Mail Stop:
>Title:
>Organization:
>Address:
>City/State/Zip:
>Phone:  Fax:  E-Mail:
>
>Presentation Category:
>Presentation Title:
>
>Submission Dates:
>Chair Reply:  August 12, 1999
>Abstracts:  September 2, 1999
>Technical Paper:  January 14, 1999
>
>Fax or mail this form, along with your abstract to:
>Stephannie Caliendo, IPC Phone: 847-790-5302
>2215 Sanders Rd.  Fax:  847-509-9798
>Northbrook, IL  60062 E-mail: [log in to unmask]
>
>FOR MORE INFORMATION ON IPC PRINTED CIRCUITS EXPO VISIT:
>www.ipcprintedcircuitexpo.org