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July 1999

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Subject:
From:
Huffman Connie WRALC/LYPME <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Jul 1999 11:14:55 -0400
Content-Type:
text/plain
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text/plain (87 lines)
Hello Mike,
What would be the ramifications of using the methanesulfonic as opposed to
the fluoborate?  Is one worse than the other on the subject resist system?
Thanks, Connie Huffman
WRALC
> -----Original Message-----
> From: Carano,Michael [SMTP:[log in to unmask]]
> Sent: Monday, July 12, 1999 10:36
> To:   [log in to unmask]
> Subject:      Re: [TN] RV: Dry film adherence problems
> 
> Dear Sir,
> 
> Is it possible that your tin-lead plating solution may be aggressively
> attacking the photoresist at the base of the copper, causing the resist to
> lift? It is possible that the resist may not be compatible with the
> parameters you are using in your plating process.  
> 
> Suggest that you try increasing the metal content of the tin-lead
> electrodeposition solution and lower the acid content.
> You did not mention if you are using a methanesulfonic acid or fluoborate
> type electrolyte for your plating process. Since you are seeing tin-lead
> plating on the base, it may be caused by the tin-lead plating process.
> 
> Good luck,
> 
> Mike Carano   
>         -----Original Message-----
>         From:   CIPSA [SMTP:[log in to unmask]]
>         Sent:   Monday, J, uly 12, 1999 4:22 AM
>         To:     [log in to unmask]
>         Subject:        [TN] RV: Dry film adherence problems
> 
>          
> 
>          
>         Dear Sirs,
>          
>         The reason why we send this e-mail is because we are having 
>         problems of adherence of our dry film Dupont 4615.
>         The problem always appears beside the track/pads, and in the final
> pcb
>         you always can see a bigger track, because the adherence of the
> film
> has
>         not good and some Sn/Pb has get on the base copper (the film has
> not
> 
>         protect correctly the base copper, beside the track).
>          
>         We have done the following corrective actions and there has not
> been
>         any success at all:
>         1. We have increased the lamination temperature from 105 to 115ºC.
>         The presion is about 4 bars. The lamination rolls speed is about
> 1,6-2 m/min.
>         2. We have checked the pH of the revelator solution and goes from
> pH
>         11 at the beginnig to 10,4 at the end of the solution live.
>         3. We are quite sure that is not a electrolitic line problem,
> because in the
>         same bath position, we have panels with and without problems.
>         4. We have checked all the insolation parameters and everything is
> OK.
>          
>         What we are doing now, is changing from Dupont film 4615, to 215.
>         Maybe, it will solve the problem, but we don't know the cause of
> our
> problem.
>          
>         Does anybody knows the cause of our problem ???
>          
>         Thank you in advance for your colaboration.
>          
>         Albert Varon
>         Quality Manager.
>          
>          
>         **********************************************************
>         CIRCUITOS IMPRESOS PROFESIONALES,S.A..
>         Pol.Ind.Els Bellots C/de l'Aigua, 28
>         08227 TERRASSA (Barcelona) SPAIN
>         Apdo. de correos 597-598
>         Telf. 34.937856793 Fax 34.937861905
>         **********************************************************
> 	

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