Hi Ioan
Try drying/degassing for 2 hours at 120°C (or 80°C, evacuated) to remove the
adsorbed moisture out of the laminate.
Bernhard

        ----------
        Von:  Tempea, Ioan[SMTP:[log in to unmask]]
        Gesendet: Freitag, 9. Juli 1999 17:18
        An:  [log in to unmask]
        Betreff:   [TN] PCB blistering during wave

        Fellow technetters,

        we are presently fighting with some ultra low-end TH only PCBs.
During
        waving they blister a lot. We tried many things like hotter-colder
        preheating, hotter-colder solder temp, faster-slower speed. No
result.

        Are there any other tricks to try, or we send them back to the fab?

        Thanks, Ioan