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July 1999

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Subject:
Plugged Via
From:
Thomas Han <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 9 Jul 1999 07:54:08 -0700
Content-Type:
text/plain
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text/plain (9 lines) 
I'm running a kit which requires placing 2 484 pin fine line BGA's(Altera-
1.00mmpitch, dimensions of the BGA is smaller than that of standard
256PBGA)  Upon inspecting the fabs, I noticed high number of vias that are
filled with solder. I am concerned about the high probability of solder
bridges upon reflow.  Any suggestions or input on how I should go about
doing it?

Tom

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