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July 1999

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TechNet <[log in to unmask]>
Subject:
R-Pak Wavesolder Footprint
From:
"McMonagle, Michael R." <[log in to unmask]>
Date:
Wed, 7 Jul 1999 18:07:10 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, "McMonagle, Michael R." <[log in to unmask]>
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Folks,
        I am looking for a 'wave optimized' footprint for an RN-EXBV
R-Pak. It is a 1206 style package with 8 'cup' style terminations. The
footprint I have from my SMT Plus book is for paste, not wave, and I'm
sure there are some differences to assure better  solderability of these
cups in the wave. TIA for any assistance....

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX  77478
(281) 243-5639 Phone
(281) 243-5539 Fax
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