Considering the simmilar embrittlement effect of Ag ; as in Au ;
is there some recognised volume content (as if I remember correctly 4% of
Au[Klein Wassink])of Ag in a joint ?
Some of the Ag alloys cycling results did not look so hot . ?

Thanks a lot

Paul Klasek
ResMed

-----Original Message-----
From: Michael Fenner [mailto:[log in to unmask]]
Sent: Friday, 30 July 1999 3:31
To: [log in to unmask]
Subject: Re: [TN] PALLADIUM SILVER FINISH


The PAd/Ag mostly dissolves on soldering so make sure that you specify the
component to have a nickel barrier coat or underlay otherwise you stand a
good chance of getting down to bare ceramic. This is a standard presentation
and should not be a problem for your supplier.

Mike Fenner
BSP, OX15 4JQ, England
T: +44 1295 722 992
M: +44 789 999 7715
F: +44 1295 720 937


-----Original Message-----
From: Jim Marsico 516-595-5879 <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: 29 July 1999 15:11
Subject: [TN] PALLADIUM SILVER FINISH


>Hello again...
>
>Any concerns soldering a surface mount chip component with a palladium
silver
>finish?
>
>Thanks in advance
>
>Jim Marsico
>
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