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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 29 Jul 1999 08:18:51 -0400 |
Content-Type: | text/plain |
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We have a very serious dewetting problem with at least one supplier. We have
seen as much as 80% with the HASL down to 10 microinches. The area of
dewetting can not be reflowed, we have tried. problem is from copper/tin
intermettalics, poor cleaning after applying solder mask, contamination,
etc. get a good FA lab like NEXTEK and have them run on a X-Ray floroscope.
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