>Moti Holtzman wrote:
>I saw your email in regard to UN uniform plating copper I did not follow from
>the beginning whet is the application If you have non uniform plating one of
>the way to day is to use Complex Wave Form-Pulse reverse plating it improved
>the plating through and surface uniformity My expertise is the implementation
>of the technique if I can give you more information do email me and I will
>reapply ASAP.
>Looking forward to hear from you
>
>Moti Holtzman
>ASET Inc.
>
Moti,
I would like to find out more about the pulsed reverse plating that you
mentioned. Is there an article or a manufacturer of equipment you could
recommend?
Thank you,
Michael Meltzer
Lawrence Livermore National Laboratory
(925) 424-6923
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