Due to problems we have been having with our mail server, I am resending the
following two announcements on IPCWorks '99.
++++++++++++++++++++++++++++++++++++++++++++=
IPCWorks '99 Conference Schedule - Day 1
The following is the tentative schedule for the IPCWorks '99 conference, featuring an
International Summit on Lead-Free Electronics Assemblies. Please note that the
schedule could still change. If we do make any changes to the schedule, you will be
informed.
Monday, October 25, 1999, 1:00 p.m. to 5:00 p.m.
An International Summit on Lead-Free Electronics Assemblies
We thought the best way to start of the conference would be by bringing conference
attendees up to date on the lead elimination activities in place in Europe and Japan.
European legislation and timelines set by Japanese companies for lead elimination in
electronics assemblies are adding pressure to US companies to prepare for the same. A
panel of industry experts representing Europe, Japan and the US will discuss the
history of lead elimination and how your company can prepare for the transition.
Following the afternoon program will be a reception where conference attendees can
meet and talk with the presenters.
Presentations, An International Summit on Lead-Free Electronics Assemblies
A Review of the Environmental Issues in Electronics and the Potential for Lead-Free
Soldering - Dr. Kay Nimmo, International Tin Research Institute Lead-Free Soldering
Technology Centre
Reduced Environmental Impacts by Lead-Free Electronics Assemblies - Dr. Jutta
Mueller, Fraunhofer Institute for Reliability and Microintegration
Environmental and Toxicological Aspects of Traditional Tin/Lead Soldering Compared to
Lead-Free Alternatives - Frans Christensen, Danish Toxicology Centre
The Status of Lead Elimination in Japan - Prof. Katsuaki Suganuma, Osaka University
The EC Directive: A Status of Lead Elimination in Europe - Brian Haken, PCIF
NEMI Task Force Report - Ron Gedney, NEMI
The next posting on the conference will break down Day Two:
Keynote
NIST Report
Components
Alloys
-----------------------------------------------------------------------------
IPCWorks '99 Conference Schedule - Day 2
The following is the tentative schedule for the second day of the IPCWorks '99
conference, featuring an International Summit on Lead-Free Electronics Assemblies.
Please note that the schedule could still change. If we do make any changes to the
schedule, you will be informed.
**********************************************************************
Tuesday, October 26, 1999
8:00 a.m. to 8:30 a.m.
KEYNOTE
Dr. Iwona Turlik, Motorola - Electronics and the Environment
8:30 a.m. to 9:00 a.m.
NIST REPORT
Carol Handwerker, NIST
9:00 a.m. to 10:30 a.m.
COMPONENTS SESSION
Component finishes are one of the three key ingredients to lead-free electronics
assemblies. In this session, several component suppliers will bring you up to date on
their activities with lead-free component finishes
Presentations, Components Session
Piezoelectric Properties of Bismuth Layer-Structure Ceramics, Masakazu Hirose, TDK
Corp.
An Assessment of Lead Free Palladium Finished Components: The Impact on Assembly
Yields with Conventional Tin-Lead Solder, Dr. Chris Hunt, National Physical
Laboratory, Centre for Materials Measurement Technology
Lead Free Flip Solder for Flip Chip and CSP Applications, Peter Elenius, Flipchip
Technologies
10:30 a.m. to 5:00 p.m.
ALLOYS SESSION
The recipes for lead-free alloy alternatives are very expansive. Which alloy will be
the replacement. What are the criteria for selecting the alloys? Is Sn/Ag/Cu the
answer? How about Sn/Cu or Sn/Ag/Bi? Attendees of this session will gain a better
understanding of the alternatives and how to select the alternative to suit their
needs.
Presentations, Alloys Session
Alloy Selection by Worldwide Region and the Pros and Cons of the Various
Alternatives, Chris Bastecki, Alpha Metals
An Evaluation of Prototype Laminate and HMC Circuit Boards Assembled with Sn-Ag-Bi
and Sn-Ag-Bi-X Solders, Paul Vianco, Sandia National Labs
A Comparison of the Available Lead-Free Alloys to Tin-Lead Alloys, Karl Seelig, AIM
Solder
Development of Eutectic and Near-Eutectic Sn/Ag/Cu Solder Alloys for Lead-Free
Electronic Assemblies, Iver Anderson, Ames Lab
Improvement of Sn/Zn Alloys Soldering by Preventing Oxidation of Ink, Masahiro
Tadauchi, Toshiba Chemical Corp.
High Reliable Lead-Free Solder Pastes from Tn/Zn Alloy Systems, Takashi Shoji, Showa
Denko K. K.
Eutectic Sn-Bi as an Alternative Pb-free Solder, Fay Hua, Hewlett-Packard Company
An Integrated Approach to Lead-Free Processing, Alan Rae, Cookson
Prospect of Lead Free Alternatives for Reflow Soldering, Dr. Ning-Cheng Lee, Indium
Corporation of America
The Future is Now: No Longer Creeping Towards Lead Elimination, Angela Grusd, Heraeus
********************************************************
The next posting will cover day three, which will be host to the breakout sessions
for the development of the IPC roadmap on lead elimination.
Chris Jorgensen
Technical Project Manager
IPCWorks '99 Conference Coordinator
An International Summit on Lead-Free Electronics Assemblies
October 25 - 28, 1999
Hyatt Regency, Minneapolis, MN
To stay on top of the lead elimination issue, subscribe to the [log in to unmask]
e-mail forum.
To subscribe compose the following email message:
TO: [log in to unmask]
SUBJECT: (leave blank)
MESSAGE: subscribe leadfree YOUR NAME
################################################################
Leadfree E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask]
with following text in the body:
To subscribe: SUBSCRIBE Leadfree <your full name>
To unsubscribe: SIGNOFF Leadfree
################################################################
IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
Assemblies.
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.ipc.org/html/leadfree.htm ) for additional information.
For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
################################################################
|