Bob:
I was looking for comments from other component suppliers to the concept of
developing a "not to exceed" assembly profile. Specifically members of JEDEC
JC14.1 who developed these J standards in conjunction with the IPC.
Most of these people are in the West and they haven't come in yet.
Pete Brooks
-----Original Message-----
From: Martel, Robert [SMTP:[log in to unmask]]
Sent: Wednesday, July 07, 1999 9:39 AM
To: 'Leadfree Electronics Assembly E-Mail Forum.'; Brooks, Peter
Subject: RE: [LF] Component reliability at higher soldering
temperatures
Peter,
See the new J-STD-020A and J-STD-033. Based on the limits called out
there
for the procedures to use in rating a part's moisture level, you should
be
able to derive not-to-exceed profile limits for your process.
Bob
-----Original Message-----
From: Brooks, Peter [SMTP:[log in to unmask]]
Sent: Wednesday, July 07, 1999 8:19 AM
To: [log in to unmask]
Subject: Re: [LF] Component reliability at higher
soldering
temperatures
David:
Obviously there is a point (more like a cliff edge) where any
component will
fail. I have internally asked our reliability department to come
up
with an
assembly "not to exceed" profile (maximum ramp/cooling rate and
maximum
time/temperature etc) that could be used as boundary conditions
for
this
project.
The comment that came back was that this is "IMPOSSIBLE"
considering
all the
different packages/materials used for IC's and Discretes.
Maybe this is the time to consider the elimination of the solder
assembly
process?
Peter Brooks
-----Original Message-----
From: David Suraski - AIM
[SMTP:[log in to unmask]]
Sent: Wednesday, July 07, 1999 7:36 AM
To: [log in to unmask]
Subject: Re: [LF] Component reliability at higher
soldering
temperatures
Are there any component manufacturers involved in this
forum
who could
comment on the issue below (and others)?
Thanks,
David
-----Original Message-----
From: Charbonneau, Richard A
<[log in to unmask]>
To: 'David Suraski - AIM' <[log in to unmask]>
Cc: 'Seelig, Karl (AIM solder)' <[log in to unmask]>
Date: Tuesday, July 06, 1999 6:55 PM
Subject: Component reliability at higher soldering
temperatures
>re: recent posting to IPC Lead-free forum
>
><edited>
>
>we have found that most components can withstand this
extra
heat w/no
>degradation to their reliability....
>
>David, I would like to respond to your comment.
>
>The feedback that we are receiving from our supplier
base
is that the
higher
>soldering temperatures (even the lower 240 peak
profile)is
a
reliability
>concern for a wide range of purchased parts including
film
capacitors,
>switchs, relays, connectors, crystals, hybrids and
optoelectronic
devices
to
>name a few.
>
>regards,
>
>richard charbonneau
>
>
>
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Please visit IPC's Center for Lead-Free Electronics Assembly
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For technical support contact Gayatri Sardeshpande
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################################################################
IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
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Please visit IPC's Center for Lead-Free Electronics Assembly
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For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
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