David:

Obviously there is a point (more like a cliff edge) where any component will
fail. I have internally asked our reliability department to come up with an
assembly "not to exceed" profile (maximum ramp/cooling rate and maximum
time/temperature etc) that could be used as boundary conditions for this
project.

The comment that came back was that this is "IMPOSSIBLE" considering all the
different packages/materials used for IC's and Discretes.

Maybe this is the time to consider the elimination of the solder assembly
process?

Peter Brooks

        -----Original Message-----
        From:   David Suraski - AIM [SMTP:[log in to unmask]]
        Sent:   Wednesday, July 07, 1999 7:36 AM
        To:     [log in to unmask]
        Subject:        Re: [LF] Component reliability at higher soldering
temperatures

        Are there any component manufacturers involved in this forum who could
        comment on the issue below (and others)?

        Thanks,

        David

        -----Original Message-----
        From: Charbonneau, Richard A <[log in to unmask]>
        To: 'David Suraski - AIM' <[log in to unmask]>
        Cc: 'Seelig, Karl (AIM solder)' <[log in to unmask]>
        Date: Tuesday, July 06, 1999 6:55 PM
        Subject: Component reliability at higher soldering temperatures


        >re: recent posting to IPC Lead-free forum
        >
        ><edited>
        >
        >we have found that most components can withstand this extra heat w/no
        >degradation to their reliability....
        >
        >David, I would like to respond to your comment.
        >
        >The feedback that we are receiving from our supplier base is that the
        higher
        >soldering temperatures (even the lower 240 peak profile)is a
reliability
        >concern for a wide range of purchased parts including film capacitors,
        >switchs, relays, connectors, crystals, hybrids and optoelectronic
devices
        to
        >name a few.
        >
        >regards,
        >
        >richard charbonneau
        >
        >
        >

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