John,
Isn't the micro BGA designed to have the stress'
relieved on the device/package itself? Doesn't the
the (small) size help with this also? (PPM X and Y
expansion) Check out the Tessera website at
http://www.tessera.com/
I'm sure you'll find out the answer there.

Groovy

-----Original Message-----
From: John Harris [mailto:[log in to unmask]]
Sent: Monday, July 19, 1999 06:38 PM
To: [log in to unmask]
Subject: [TN] Underfill on Micro BGA


Micro BGA

Do Micro BGA's require underfill or encapsulation to ensure the solder
joints aren't stressed during the life of the product.

Any thoughts or recomendations would be appreciated!

Thanks

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